Technical deep dive

The technologies, named

For technical readers. The rest of the site describes what our technology does in plain terms; this page uses our internal project names and goes a level deeper. See the IP & terminology page for the full glossary.

SILO — Single 3D Lithography

Same-day manufacturing, in detail

SILO (Single 3D Lithography) is a low-temperature, mask-free semiconductor manufacturing approach designed to compress development cycles from months to days. It combines atomic-scale process control and 3D chemical printing to enable rapid design-build-test-improve cycles.

Conventional fab
SILO
Mask dependent
Mask-free
Stepper dependent
Stepper-free
Node constrained
Node independent
Weeks / months per cycle
Target: one day per cycle
Technology partitioning
Mixed technologies possible
Chiplet driven
Potentially integrated

Status: low-temperature processes demonstrated; mask-free development demonstrated; production-scale same-day fabrication under development.

BIZEN vs CMOS

Reducing transistor count, not just shrinking geometry

Conventional semiconductor development largely focuses on making transistors smaller. BIZEN focuses on reducing the number of transistors required in the first place, by changing how logic functions are implemented.

CMOS

Logic built from combinations of multiple transistors. Strong dependence on electron mobility. Scaling achieved mainly by shrinking geometry. More complexity often means more transistors.

BIZEN

Tunnel-based logic structures at atomic interfaces. Logic functions can potentially use far fewer devices. Reduces transistor count through logic implementation, not just geometry. Designed to compound with ZPOLAR speed gains.

Status: architecture patented; device-level benefits projected from the architecture; full commercial validation under development.

BIZEN + ZPOLAR

Two independent multipliers

BIZEN and ZPOLAR are not sequential inventions — they are independent technologies that compound. ZPOLAR focuses on switching behaviour, speed and device operation. BIZEN focuses on logic implementation and transistor reduction. Together they are intended to reduce overall system complexity from two directions at once.

T = AZ²

A direction of improvement that emerges from the loop, not a starting point.

Within the framework: A = atomic manufacturing — underpinned by low-temperature manufacturing, SILO and the implementation of BIZEN. Z₁ = BIZEN logic · Z₂ = ZPOLAR switching. The two device technologies (Z) compound with one another, and atomic manufacturing (A) multiplies the result — so the combined effect is far greater than any one technology alone.

For the plain-English overview

See the complete system operating

Nobody flies to see a contact form. They come to see it working.

Watch the Centian Loop® run. See same-day fabrication at FAB 107. Discuss franchise deployment. A private demonstration for qualified organisations.